Supermicro Launches Modular Solutions for AI Data Centers
On May 15, 2025, Supermicro introduced its Data Center Building Block Solutions (DCBBS), a modular framework designed to streamline the construction of AI-focused, liquid-cooled data centers. This comprehensive offering encompasses pre-validated components such as servers, storage, networking, and cooling systems, aiming to simplify the deployment process. By providing standardized yet customizable modules, Supermicro seeks to reduce the complexity and time associated with building advanced AI infrastructure.
A standout feature of the DCBBS is its integration of Supermicro's next-generation Direct Liquid Cooling (DLC-2) technology. This system enhances energy efficiency by capturing up to 98% of heat directly from components like GPUs and CPUs, allowing for higher inlet water temperatures and reducing the need for traditional chillers. The DLC-2 technology not only lowers power consumption by up to 40% but also decreases water usage and operational noise, contributing to a more sustainable and cost-effective data center environment.
Supermicro's DCBBS also offers scalability to meet the demands of large-scale AI workloads. For instance, a single deployment unit can support up to 2,048 NVIDIA Blackwell GPUs, interconnected with high-speed networking solutions. This level of scalability, combined with the modular design, enables rapid deployment—potentially reducing buildout times to as little as three months. By addressing both performance and efficiency, Supermicro positions its DCBBS as a compelling solution for organizations looking to expand their AI capabilities swiftly and sustainably.
